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Sivers' Future Subsidiary MixComm to Develop 5G mmWave Solutions

Sivers' Future Subsidiary MixComm to Develop 5G mmWave Solutions Image Credit: SasinP/Bigstockphoto.com

Sivers Semiconductors this week announces that the company’s future subsidiary MixComm has entered a partnership with Advanced Microsystems Technologies, a division of Sanmina, to productize its 5G wireless infrastructure solutions.

The division will provide design, packaging, assembly, and testing services that integrate MixComm’s low power and beam forming chips into an innovative AiP package that simplifies and miniaturizes the product design. This work will enhance the performance of MixComm’s solutions and speed time to market for Sanmina’s and MixComm’s mutual customers.

On October 14, 2021, Sivers Semiconductors entered into an agreement to acquire 100 per cent of the share capital of MixComm, a US-based mmWave challenger and fabless semiconductor company.

MixComm has selected Advanced Microsystems Technologies, a division of Sanmina as a lead partner to productize its 5G wireless infrastructure solutions. The division will provide design, packaging, assembly, and testing services that integrate MixComm’s low power and beam forming chips into an innovative AiP package that simplifies and miniaturizes the product design. The solutions will be based upon MixComm’s SUMMIT2629 Beamformer Front End IC and the recently announced ECLIPSE3741 Antenna in Package (AiP).

The productization work will include design for manufacturability and thermal characterization. This work will enhance the performance of MixComm’s solutions and speed time to market for Sanmina’s and MixComm’s mutual customers.

Eric Sislian, VP of the Advanced Microsystems Technologies division at Sanmina
By combining our design and advanced manufacturing capabilities with MixComm’s leading RF technologies, we believe we can accelerate commercialization of AiP solutions that enable wireless communications providers to provide a high-quality user experience and expand their 5G networks.

Dr. Harish Krishnaswamy, MixComm Co-Founder and CTO
With Sanmina, we are developing mechanical and thermal strategies for AiP that are mass manufacturable. Through this partnership, we will substantially lower the barrier to entry into the millimeter-wave market for our customers.

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Ray is a news editor at The Fast Mode, bringing with him more than 10 years of experience in the wireless industry.

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