First Details Regarding Next-Gen MediaTek Flagship SoC Surface

It hasn’t been long since MediaTek unveiled its latest flagship SoC for smartphones, the Dimensity 9000. The new chipset is yet to find its way inside any smartphone available in the current market. Meanwhile, the company seems to have already made significant progress with the development of its successor.

According to Equal Leaks on Telegram, MediaTek’s next-gen flagship SoC will be based on a 3nm process node. This is an expected generational upgrade considering all current flagship chipsets, including the Dimensity 9000, use the 4nm architecture.

Taiwanese chip giant TSMC will reportedly manufacture the upcoming MediaTek chipset. Compared to the previous generation SoCs, i.e. those based on 5nm processes, TSMC’s 3nm chipsets will have 1.7 times higher logic density and will bring about an 11 percent improvement in performance. Power consumption will also go down by 25 to 30 percent.

Coming to the name, MediaTek’s next-gen flagship SoC is expected to be called the Dimensity 10000. The company already has the Dimensity 8000 and Dimensity 9000 in its lineup, so Dimensity 10000 seems a logical branding. Things should get clearer in the coming months. MediaTek is looking to release the new processor before the end of this year.

The MediaTek Dimensity 10000 will compete against Qualcomm’s Snapdragon 8 Gen 2

The chip war between MediaTek and Qualcomm has been getting fierce in recent years. The former overthrew the American biggie as the world’s largest smartphone chipmaker in 2020. But the latter still holds an upper hand in the flagship market, which is considered the most crucial market.

However, MediaTek’s current flagship offering, the Dimensity 9000, could give Qualcomm’s Snapdragon 8 Gen 1 a run for its money this year. The two SoC’s look as good as the other on paper. And comes the time of the Dimensity 10000 and the Snapdragon 8 Gen 2, MediaTek may come out on top as well. That’s based on early reports that Qualcomm’s next-gen flagship SoC will be based on TSMC’s 4nm process.

However, if TSMC’s 3nm tech will be ready for mass-production by the end of this year, there’s no reason why Qualcomm will stick to the current 4nm node. The Taiwanese company is said to be investing around $44 billion to expand its chip business this year. So it could very well make the next-gen chip fabrication tech production-ready come December 2022.

That said, these are still very early days. Things could change as the companies proceed with the development of their respective products. We will let you know as and when we have more information.