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First Commercially Scalable Integrated Laser and Microcomb on a Single Chip

Noozhawk
 2021-07-05

Fifteen years ago, UC Santa Barbara electrical and materials professor John Bowers pioneered a method for integrating a laser onto a silicon wafer. The technology has since been widely deployed in combination with other silicon photonics devices to replace the copper-wire interconnects that formerly linked servers at data centers, dramatically increasing energy efficiency — an important endeavor at a time when data traffic is growing by roughly 25% per year.

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